cisco systemsSan Jose, CA
Advanced Packaging Design Engineer (Hybrid)
Overview:
In this role you will help develop complex ASIC package designs from planning through tapeout, collaborating with SI/PI, silicon, and layout teams to deliver high-speed, manufacturable solutions. You’ll work within Cisco Silicon One’s advanced packaging environment to enable scalable, high-performance networking silicon. The position emphasizes cross-functional problem solving and method development, with impact across product tapeout and system integration. This is a hands-on role that combines architecture, optimization, and execution to shape next‑gen networking devices. You will join a collaborative team solving challenging packaging problems at scale. Compensation / Benefits competitive salary paid time off and holidays 401(k) with Cisco matching parental leave health, dental, and vision insurance restricted stock units (RSUs)
Responsibilities:
Contribute to package design activities including planning, floor planning, pinout optimization, stack-up definition, and high-speed routing support Collaborate with SI/PI, silicon floor planning, layout, and manufacturing teams to ensure high-quality package solutions Support package implementation activities and work with layout editors to align design intent with physical implementation Participate in technical investigations, design reviews, and tradeoff discussions on performance, manufacturability, and schedule Assist in developing and improving package design methodologies, flows, and best practices Contribute to debugging, issue resolution, and package bring-up activities as needed Work with package leads and senior engineers on complex package programs and progressively take ownership of larger design scopes
Key requirements:
Bachelor’s in Electrical Engineering preferred; 5+ years of experience or Master’s with 3+ years in Electrical Engineering or related field Experience in hardware, package, PCB, or high-speed design engineering Experience with high-speed signaling, power delivery, and system-level hardware concepts Experience with industry-standard EDA tools for package or PCB design Cross-functional collaboration Technical problem solving Effective communication in design reviews ASIC package design SI/PI concepts Advanced packaging technologies, interposers, or multi-die systems (advantage)
Also on the board Same function, level within a rung
Level
Senior
Location
San Jose, CA
Occupation
Electronics Engineers, Except Computer
Industry
Computer Systems Design Services
Posted
today