rapidus usSanta Clara, CA
Senior Chiplet Packaging & Design Enablement Lead
Senior Chiplet Packaging & Design Enablement Lead
Senior Chiplet Packaging & Design Enablement Lead
rapidus usSanta Clara, CA
yesterday
Electronics Engineers, Except ComputerComputer Hardware EngineersRadio Frequency Identification Device Specialists
Printed Circuit Assembly (Electronic Assembly) ManufacturingElectronic Connector ManufacturingSemiconductor and Related Device Manufacturing
Apply for this role →Rapidus Corporation US is seeking a Customer Package Design Integration Engineer to drive chiplet-based product development and packaging technology integration. You will serve as the primary technical interface between Rapidus and customers, aligning ADKs, packaging, and customer design activities toward successful tape-out.
You will combine deep expertise in 2.5D/3D packaging with program management and cross-functional coordination to lead designs from bring-up through tape-out across global
Also on the board Same function, level within a rung
Level
Senior
Location
Santa Clara, CA
Occupation
Electronics Engineers, Except Computer
Industry
Printed Circuit Assembly (Electronic Assembly) Manufacturing
Posted
yesterday