Senior Manager, Business Development & ESI

Responsibilities: Identify, qualify, and open new accounts across consumer electronics, wearables, IoT, medical devices, and AI hardware, with a focus on Silicon Valley and other US-based OEMs. Build and maintain a target account plan covering decision-makers in R&D, mechanical engineering, NPI, sourcing, and supply chain; grow wallet share at existing US customers. Lead pursuit cycles end to end: capability briefings, site visits, NDAs, supplier qualification, RFQ response, and commercial negotiation through to award. Early Supplier Involvement Embed with customer engineering teams during concept and EVT/DVT phases; lead joint design reviews, DFM/DFA workshops, tooling strategy sessions, and materials and finishing selection. Position Hi-P's vertically integrated offering — precision plastics, metal stamping, surface finishing, PCBA, and mechatronic assembly — into customer designs to reduce cost, risk, and supplier count. Translate customer technical requirements and roadmaps into clear briefs for Hi-P engineering, and coordinate prototype builds and samples with Asia sites. Commercial & program ownership Own a portfolio of ESI/BD opportunities in the CRM; maintain accurate forecasts and report pipeline, win/loss, and revenue progress to the VP, Business Development & ESI. Work with BU general managers, costing, and engineering on quoting strategy, value-engineering proposals, and commercial terms (NRE, tooling, volume pricing). Support the hand-off from award to program management so launch commitments are met; stay engaged through ramp to protect the customer relationship. Cross-functional collaboration Act as the day-to-day bridge between US customers and Hi-P engineering and operations teams in Suzhou, Chengdu, and other Asia sites, working across US–Asia time zones. Bring customer feedback and market intelligence back to Hi-P to inform capability roadmap, equipment investment, and process technology priorities. Help build the ESI playbook, customer engagement tools, and capability collateral; mentor junior ESI engineers or account managers as the team grows.

Education: Bachelor's degree in Mechanical Engineering, Manufacturing Engineering, Industrial Engineering, Materials Science, or related discipline. MBA or advanced engineering degree is a plus.

Experience: 6–10 years total, including at least 3 years in a customer-facing engineering, technical sales, business development, or account management role at an EMS / ODM / contract manufacturer (e.g., Foxconn, Flex, Jabil, Celestica, Sanmina, Pegatron, Wistron, Compal, Luxshare, BYD Electronics), or in a supplier-facing engineering or sourcing role at a hardware OEM. Domain depth: Solid working knowledge of precision injection moulding, metal stamping, tooling, surface finishing, mechatronic assembly, and DFM/DFA principles; able to hold credible technical discussions with product designers and mechanical engineers. Track record: Demonstrated success opening accounts and winning multi-million-dollar manufacturing programs; existing relationships with engineering, NPI, or supply-chain teams at one or more US hardware-led companies. Commercial skills: Comfortable building quotes and business cases, negotiating terms, and managing a pipeline with discipline using CRM tools. Communication: Excellent written and spoken English; able to present clearly to customer engineering leads, sourcing managers, and senior management.

Preferred Qualifications: Working proficiency in Mandarin Chinese. Prior experience in an ESI, NPI, or customer engineering role at an EMS/ODM. Exposure to medical device (ISO 13485) or automotive (IATF 16949) programs in addition to consumer electronics. Experience with vertically integrated programs combining plastics, metals, and electronics. Existing US work authorization; no sponsorship required.