amkor technologyTempe, AZ
Senior Director, Chiplet Packaging & FCBGA Innovation
Senior Director, Chiplet Packaging & FCBGA Innovation
Senior Director, Chiplet Packaging & FCBGA Innovation
amkor technologyTempe, AZ
yesterday
Computer Hardware EngineersSemiconductor Processing TechniciansElectronics Engineers, Except Computer
Semiconductor and Related Device ManufacturingSemiconductor Machinery ManufacturingResearch and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
Apply for this role →Amkor Technology, Inc. in Tempe, AZ seeks a Sr. Director, Chiplets/FCBGA to lead strategy, development, and execution of advanced chiplet-based module technologies including HDFO and other IC package solutions for AI, HPC, and networking markets.
The role interfaces with Tier 1 customers and Amkor's R&D center in South Korea, driving roadmaps, customer engagement, and successful commercialization of next‑gen packaging solutions. 20% domestic and 20% international travel required.
Also on the board Same function, level within a rung
Level
Manager
Location
Tempe, AZ
Occupation
Computer Hardware Engineers
Industry
Semiconductor and Related Device Manufacturing
Posted
yesterday