Lead ASIC Package Architect — FC-BGA & MCM

K2 Space Corporation in Los Angeles invites a Principal ASIC Package Design Engineer to lead FC-BGA and MCM packaging strategy for high-performance mixed-signal and digital SoCs, guiding architecture, trade studies, and production ramp. You will set packaging standards, work with silicon, RF, and systems teams, optimize PDN and thermal design, and coordinate with OSATs and substrate vendors to meet roadmap commitments.