Senior Wafer Bonding Process Engineer
Senior Wafer Bonding Process Engineer
1000 micron technologyBoise, ID
yesterday
Semiconductor and Related Device ManufacturingSemiconductor Machinery ManufacturingPrinted Circuit Assembly (Electronic Assembly) Manufacturing
Apply for this role →Micron Technology, Inc. in Boise, Idaho seeks a Staff/Principal Wafer Bonding Process Engineer to lead next‑gen DRAM bonding processes. You will plan experiments, improve yield, reduce costs, and drive productivity using data‑driven, AI‑assisted approaches.
You will evaluate new equipment and materials, mentor teams, and collaborate across multiple functions to ensure manufacturing readiness and quality at scale.
Also on the board Same function, level within a rung
Level
Lead
Location
Boise, ID
Occupation
Semiconductor Processing Technicians
Industry
Semiconductor and Related Device Manufacturing
Posted
yesterday