Global Foundries is a leading semiconductor foundry seeking a senior packaging process integration engineer to lead post‑Fab process development focused on wafer finishing and assembly for advanced packaging and silicon photonics. The role involves cross‑functional collaboration with design, fabrication and packaging teams to meet customer requirements and drive new assembly flow development. The candidate will drive CMP, thinning and dicing, with a strong emphasis on process integration, IP

Also on the board Same function, level within a rung

Level

Senior

Location

Essex Junction, VT

Occupation

Packers and Packagers, Hand

Industry

Semiconductor and Related Device Manufacturing

Posted

yesterday

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Senior Advanced Packaging Process Integration Engineer at...