Lead Mechanical Simulation Engineer – Packaging
Lead Mechanical Simulation Engineer – Packaging
sk hynix americaSan Jose, CA
yesterday
Semiconductor Machinery ManufacturingSemiconductor and Related Device ManufacturingResearch and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
Apply for this role →SK hynix America is seeking a highly skilled and motivated Mechanical Simulation Engineer to join our Advanced Packaging (PKG) R&D team. You will drive the mechanical integrity of next‑generation packaging solutions (HBM, 2.5D/3D integration) using advanced numerical methods to predict thermo‑mechanical behavior in complex IC packages.
Collaborate with design and process teams to optimize warpage, solder joint reliability, and interfacial adhesion, and map system‑level interactions to board and
Also on the board Same function, level within a rung
Level
Senior
Location
San Jose, CA
Occupation
Mechanical Engineers
Industry
Semiconductor Machinery Manufacturing
Posted
yesterday