renesasSan Jose, CA
Principal Advanced Packaging Engineer: 2.5D/3D SiP Leader
Principal Advanced Packaging Engineer: 2.5D/3D SiP Leader
Principal Advanced Packaging Engineer: 2.5D/3D SiP Leader
renesasSan Jose, CA
yesterday
Semiconductor and Related Device ManufacturingOther Electronic Component ManufacturingSemiconductor Machinery Manufacturing
Apply for this role →Renesas Electronics, based in San Jose, is seeking a Principal Package Design Engineer to lead advanced packaging development for high-performance semiconductors. You will own architecture definition, reliability, and cross-functional collaboration with design, substrate, and manufacturing teams.
The role requires 5+ years in semiconductor packaging, MSc/PhD preferred, and hands-on experience with Cadence Allegro, ANSYS, and other design tools.
Also on the board Same function, level within a rung
Level
Lead
Location
San Jose, CA
Occupation
Electronics Engineers, Except Computer
Industry
Semiconductor and Related Device Manufacturing
Posted
yesterday