Process Engineer, Advanced Packaging & Die Bonding
Process Engineer, Advanced Packaging & Die Bonding
fabrinet westSanta Clara, CA
yesterday
Semiconductor Machinery ManufacturingElectronic Connector ManufacturingSemiconductor and Related Device Manufacturing
Apply for this role →Fabrinet West in Santa Clara, CA is seeking an engineer to develop and optimize die attach and wire bond processes for prototype, NPI, and production assemblies in the advanced packaging cleanroom.
You will create and qualify machine/process recipes for die bonder, wire bonder, plasma cleaner, epoxy dispenser, and optical alignment equipment, while leading root cause analysis and defining inspection criteria.
Also on the board Same function, level within a rung
Level
Mid
Location
Santa Clara, CA
Occupation
Engineers, All Other
Industry
Semiconductor Machinery Manufacturing
Posted
yesterday