GLOBALFOUNDRIES U.S. INC. is seeking a Packaging Engineer within its Integrated Optics organization to lead development and sustainment of advanced optical packaging for silicon photonics and co‑packaged optics. You will drive fiber-to-chip coupling, 2.5D/3D packaging, and cross‑functional collaboration across photonics, electrical, mechanical, and manufacturing teams. The role requires a Master’s degree in a relevant field, 8+ years of packaging experience, and strong English communication.

Also on the board Same function, level within a rung

Level

Senior

Location

Essex Junction, VT

Occupation

Photonics Engineers

Industry

Semiconductor and Related Device Manufacturing

Posted

yesterday

Apply for this role →