renesas electronicsCalifornia, MO
Director, Power Package Design & SiP Innovation
Director, Power Package Design & SiP Innovation
Director, Power Package Design & SiP Innovation
renesas electronicsCalifornia, MO
yesterday
Semiconductor and Related Device ManufacturingOther Electronic Component ManufacturingSemiconductor Machinery Manufacturing
Apply for this role →Renesas Electronics Corp. is seeking a senior specialist in package technology development to lead NPI/R&D and OSAT management for new power packaging solutions. Focus areas include AI/datacenter power packaging, SiP/module design, and advanced interconnects.
You will work with product and reliability teams to qualify new packages and establish process specs. The role requires 15–20 years in package development, strong knowledge of wafer-level/flip-chip packaging, and excellent analytical
Also on the board Same function, level within a rung
Level
Manager
Location
California, MO
Occupation
Electronics Engineers, Except Computer
Industry
Semiconductor and Related Device Manufacturing
Posted
yesterday