Intel Corporation's Advanced Packaging Technology Manufacturing (APTM) team in Chandler, AZ seeks a Packaging Module Development Engineer to develop, optimize, and qualify advanced semiconductor packaging processes for high-volume production. You will lead experiments, specify materials and equipment, and collaborate with manufacturing and product teams to enable reliable, cost-effective packaging solutions.

Also on the board Same function, level within a rung

Level

Mid

Location

Brooklyn, NY

Occupation

Semiconductor Processing Technicians

Industry

Semiconductor and Related Device Manufacturing

Posted

yesterday

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Packaging Process Engineer – Advanced Semiconductors at intel |...