Quantum Backend Process Engineer: Die Bonding
Quantum Backend Process Engineer: Die Bonding
googleGoleta, CA
yesterday
Other Electronic Component ManufacturingResearch and Development in NanotechnologySemiconductor and Related Device Manufacturing
Apply for this role →Google LLC in Goleta, CA, is seeking a Fabrication Backend Process Engineer for Quantum AI to advance die singulation, hybridization, and device characterization. You will develop scalable bonding and die preparation processes and work with cross-functional teams to optimize yield and reliability.
The role emphasizes equipment qualification, process integration, and rigorous attention to quality standards, with compensation including equity and a 15% bonus target in addition to benefits.
Also on the board Same function, level within a rung
Level
Lead
Location
Goleta, CA
Occupation
Physicists
Industry
Other Electronic Component Manufacturing
Posted
yesterday