Senior IC Package Layout Engineer 2.5D/3D-IC

Annapurna Labs (U.S.) Inc. within AWS is seeking a Package Layout Design Engineer to advance IC packaging for AI/ML hardware. You will handle floor planning through tape-out, collaborating with SI/PI, thermal, and manufacturing to meet performance targets. Role requires hands-on experience with package layout tools and a deep understanding of 2.5D/3D-IC, RDL, TSV, and interposer technologies. Great communication and teamwork are essential.