renesas electronicsPhoenix, AZ
Senior Power Packaging Design Engineer (NPI & OSAT)
Senior Power Packaging Design Engineer (NPI & OSAT)
Senior Power Packaging Design Engineer (NPI & OSAT)
renesas electronicsPhoenix, AZ
yesterday
Semiconductor and Related Device ManufacturingOther Electronic Component ManufacturingPrinted Circuit Assembly (Electronic Assembly) Manufacturing
Apply for this role →Renesas Electronics Corp. in Phoenix, AZ seeks a senior packaging technologist to lead development for AI/datacenter power packaging and advanced interconnects, including SiC/GaN considerations.
You will manage OSAT/CM partners, drive DOE studies, and qualify new packages within aggressive timelines. Candidate should have 15–20 years in power package development, strong wafer-level/flip-chip expertise, and excellent analytical and presentation skills.
Also on the board Same function, level within a rung
Level
Senior
Location
Phoenix, AZ
Occupation
Electronics Engineers, Except Computer
Industry
Semiconductor and Related Device Manufacturing
Posted
yesterday