Advanced Packaging Process Engineer: High-Impact
Advanced Packaging Process Engineer: High-Impact
intelChandler, AZ
yesterday
Packaging and Filling Machine Operators and TendersPackers and Packagers, HandManufacturing Engineers
Semiconductor Machinery ManufacturingElectronic Computer ManufacturingSemiconductor and Related Device Manufacturing
Apply for this role →Intel Corporation's Advanced Packaging Technology Manufacturing (APTM) team in Chandler, Arizona seeks a Packaging Module Development Engineer to advance packaging processes, drive optimization, and qualification for high‑volume production.
You will design and execute experiments using SPC and DOE, collaborate with cross‑functional engineering, manufacturing, and product teams, and contribute to reliable, cost‑effective packaging solutions that scale globally.
Also on the board Same function, level within a rung
Level
Senior
Location
Chandler, AZ
Occupation
Packaging and Filling Machine Operators and Tenders
Industry
Semiconductor Machinery Manufacturing
Posted
yesterday