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Apple Inc. in San Francisco Bay Area, CA, United States is seeking an IC Packaging Engineering Lead to drive advanced packaging architectures and mass production strategies. The role emphasizes cross-functional leadership across Silicon, Packaging, and Systems teams, with close collaboration with OSATs and assembly partners. The candidate will manage packaging tech development, ensure reliability and cost targets, and guide documentation and risk assessments for successful transitions from

Also on the board Same function, level within a rung

Level

Manager

Location

Millbrae, CA

Occupation

Computer Systems Engineers/Architects

Industry

Software Publishers

Posted

yesterday

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