Principal Design Engineer

Job Description: Principal Design Engineer- PCBA Liquid Cooling DesignJob Summary We are seeking a highly skilled PCBA Liquid Cooling Design Engineer to lead the development of innovative thermal management systems for advanced electronic assemblies. In this role, you will design direct-to-chip cold plates, custom fluid loops, and micro-channel systems that sit directly on high-density PCBAs. You will collaborate closely with hardware layout designers and manufacturing partners to build reliable, leak-free, and highly efficient cooling architectures.

Key Responsibilities: Thermal Solution Design: Architect and engineer board-level liquid cooling systems, including direct-to-chip cold plates, manifolds, and custom fittings. Simulation & Analysis: Perform Computational Fluid Dynamics (CFD) and Finite Element Analysis (FEA) using tools like Ansys Icepak, FloTherm, or Fluent to predict fluid dynamics, pressure drops, and thermal resistance. Component Integration: Select and specify critical loop components such as pumps, quick-disconnect valves, hoses, and leak detection sensors. PCBA Cross-Collaboration: Partner with PCB layout engineers to optimize component placement, layout thickness, and copper weight for maximum thermal dissipation. Prototyping & Testing: Set up and execute hardware-level thermal validation tests, including hydrostatic pressure, leak/decay verification, and environmental chamber cycling. Failure Analysis: Conduct root-cause analysis on structural stress, thermal throttling, galvanic corrosion, and fluid degradation. DFM Optimization: Ensure designs comply with Design for Manufacturing (DFM) requirements to guarantee scalable assembly and fluid charging processes on the production line.

Required: Technical SkillsCAD Software: Proficiency in 3D modeling tools like SolidWorks, PTC Creo, or Siemens NX for physical integration. CFD/FEA Tools: Advanced skills in thermal simulation software such as Ansys Icepak, FloTherm, or SimScale. PCBA Familiarity: Practical knowledge of PCB fabrication, electronic component layouts, and standard testing tools like oscilloscopes and multimeters. Fluid Dynamics & Metallurgy: Strong grasp of single-phase/two-phase heat transfer, fluid flow behavior, and material compatibility (e.g., copper-to-coolant interactions).Lab Equipment: Experience with flow meters, thermocouples, pressure transducers, and data acquisition (DAQ) systems.

Education: Masters degree in Mechanical Engineering, Thermal Engineering, or a highly related technical field.

Experience: 3+ years of experience specifically focused on electronic cooling, liquid loops, or data center thermal design. Standards: Familiarity with international standards governing pressure vessels and electronics cooling, such as ASME, ISO, and ASHRAE guidelines. Preferred

Qualifications: Experience designing cooling for AI hardware clusters, high-performance computing (HPC) environments, or EV power electronics. In-depth understanding of immersion cooling or phase-change cooling mechanisms.