Hardware Intern: Soldering & Packaging Research
Hardware Intern: Soldering & Packaging Research
ibmYorktown Heights, NY
yesterday
Computer Hardware EngineersWelders, Cutters, Solderers, and BrazersComputer and Information Research Scientists
Electronic Computer ManufacturingPrinted Circuit Assembly (Electronic Assembly) ManufacturingComputer Terminal and Other Computer Peripheral Equipment Manufacturing
Apply for this role →IBM Research invites applications for Hardware Intern 2027: Advanced Solder Processes, Yorktown Heights, NY. This internship focuses on studying bonding and reflow techniques with relevance to high-performance computing.
Ideal candidates have a High School Diploma or GED, with preferred Bachelor's degree and strong SMT soldering knowledge. The role emphasizes teamwork, data analysis, and a drive to learn new soldering innovations.
Also on the board Same function, level within a rung
Level
Intern
Location
Yorktown Heights, NY
Occupation
Computer Hardware Engineers
Industry
Electronic Computer Manufacturing
Posted
yesterday