Cryogenic Quantum Bump Integration Engineer
Cryogenic Quantum Bump Integration Engineer
globalfoundries usEssex Junction, VT
yesterday
Semiconductor and Related Device ManufacturingOther Electronic Component ManufacturingSemiconductor Machinery Manufacturing
Apply for this role →Global Foundries U.S. Inc. in Essex Junction, VT is seeking a skilled R&D bump process engineer to join the Quantum Advanced Packaging team.
You will own development and integration of cryogenic, superconducting bumping processes enabling scalable quantum hardware packaging. The role involves leading cryogenic bump tech development, defining process flows, optimizing structures, and coordinating with device/qubit, cryogenic system teams, packaging & assembly teams, modeling and reliability teams,
Also on the board Same function, level within a rung
Level
Senior
Location
Essex Junction, VT
Occupation
Physicists
Industry
Semiconductor and Related Device Manufacturing
Posted
yesterday