Hybrid Assembler III | Nonexempt

Duties and Responsibilities: Assemble hybrid components, including, but not limited to, amplifiers, oscillators, filters, switches and modules/integrated microwave assemblies. Work under a microscope for extended period of time in a clean and non-clean room environment. Some hybrid assemblies require using soldering iron. Perform bond pull and die shear. Help other assemblers to resolve issues while assembling hybrid components. Help train other assemblers to the process of assembling hybrid components.

Qualifications: Must be a High School graduate or the equivalent. Seven (7) year minimum related experience in assembling hybrid components, including, but not limited to, oscillators, amplifiers, filters, switches and modules Ability to perform eutectic die attach, component attach with conductive and non-conductive epoxy. Ability to perform ball bond, wedge bond, ultrasonic cleaning, to use parallel gap weld machine, plasma clean machine. Ability to perform bond pull and die shear. Ability to inspect microelectronic components and modules in a clean and non-clean room environment. Have Mil Specification training for Microcircuits (MIL-PRF-38534 and MIL-STD-883)Must be self-motivated, work independently, have strong people and interpersonal skills and is detail oriented. Must be able to read and work from assembly drawings. Ability to follow verbal and/or written instructions from Engineers. Soldering: J-STD-001 soldering certification.