intelPhoenix, AZ
Senior Packaging Design Architect — Substrate & IC
Senior Packaging Design Architect — Substrate & IC
Senior Packaging Design Architect — Substrate & IC
intelPhoenix, AZ
yesterday
Computer Hardware EngineersElectrical and Electronics DraftersArchitects, Except Landscape and Naval
Electronic Computer ManufacturingSemiconductor and Related Device ManufacturingPrinted Circuit Assembly (Electronic Assembly) Manufacturing
Apply for this role →Intel Corporation seeks an experienced Packaging Design Architect to drive end-to-end substrate design from concept through tape-out, and to implement physical layout and routing of the package design. You'll collaborate with silicon and hardware teams to optimize silicon-package-board performance, define substrate design rules, and resolve DRCs while documenting progress in the product lifecycle system.
Also on the board Same function, level within a rung
Level
Lead
Location
Phoenix, AZ
Occupation
Computer Hardware Engineers
Industry
Electronic Computer Manufacturing
Posted
yesterday