Senior Thermal & Mechanical Engineer, AI Silicon Packaging

Annapurna Labs, our team within Amazon Web Services, designs and optimizes semiconductor packaging for data-center scale. You will ensure thermal and mechanical integrity, run simulations, and contribute to next-generation package architectures. This role emphasizes rigorous analysis and collaboration across multiple engineering teams. Join a fast-paced environment focused on performance, quality, and cost, as we push the boundaries of packaging technology for large-scale compute workloads.