Technical Marketing Engineer – 2.5D/3DIC Packaging

Siemens Software is seeking a Technical Marketing Engineer for Advanced IC Packaging focused on 2.5D and 3DIC design flows. The role connects planning, layout, and verification tools via Tcl and Python, translating customer needs into actionable workflows. You will create technical marketing materials and demonstrate end-to-end solutions while engaging with customers worldwide. Ideal candidates have 5+ years in 2.5D/3DIC design, experience with EDA perspectives, and strong scripting abilities.