Senior Wafer Packaging Process Engineer

Arizona State University seeks a Senior Process Engineer for the Advanced Electronics and Photonics Core Facility in Mesa/Tempe. The role focuses on wafer prep and finishing in 300mm packaging, with ownership of dicing saw and wafer grinders, collaborating with physics, deposition, etching, and tests teams. The position involves developing processes, supporting operations, improving yields, and contributing to IP. Requires DoD eligibility and US citizenship; DOE in hiring process applies.