qualcommSan Diego, CA
Principal Thermal Architect — AI Compute & Packaging
Principal Thermal Architect — AI Compute & Packaging
Principal Thermal Architect — AI Compute & Packaging
qualcommSan Diego, CA
yesterday
Air-Conditioning and Warm Air Heating Equipment and Commercial and Industrial Refrigeration Equipment ManufacturingElectronic Computer ManufacturingHeating Equipment (except Warm Air Furnaces) Manufacturing
Apply for this role →Qualcomm Technologies, Inc. is seeking a Principal Thermal Engineer to solve complex thermal challenges and enable leading performance for the Dragonfly AI300 platform and future AI computing platforms.
You will work on cutting-edge thermal architecture, simulation, validation, and optimization with cross-functional teams across silicon, packaging, hardware, and system engineering. You will lead thermal design reviews, perform CFD analyses, and communicate results to stakeholders, driving
Also on the board Same function, level within a rung
Level
Lead
Location
San Diego, CA
Occupation
Mechanical Engineers
Industry
Air-Conditioning and Warm Air Heating Equipment and Commercial and Industrial Refrigeration Equipment Manufacturing
Posted
yesterday