We’re representing a venture-backed silicon photonics startup building high-performance systems for next-generation AI infrastructure. They’re looking for an ASIC/Digital Design Engineer to help architect and implement high-bandwidth silicon systems that connect compute logic with optically coupled memory and chiplet-based architectures. Experience with: ASIC digital design (RTL in Verilog / SystemVerilog) with tapeout experience in advanced nodes (e.g., 7nm and below preferred) Microarchitecture design of high-performance digital systems (pipelines, interconnects, memory hierarchies) High-speed data movement architectures (NoC, interconnect fabrics, streaming datapaths) High-speed I/O interfaces (PCIe, Ethernet, CXL, SERDES, DDR/HBM, or similar) Memory subsystem design (coherence, buffering, latency optimization, bandwidth scaling)ASIC integration across multiple IP blocks (3rd party IP, internal subsystems, interface bridging) Timing closure, PPA tradeoffs (power, performance, area) in large-scale SoCs or chiplet-based designs System-level thinking across compute + interconnect + memory boundaries
Nice to have:
  • Experience with chiplet architectures or multi-die / heterogeneous integration
  • Background in network processors, AI accelerators, or HPC-class SoCsExposure to optical interconnects, silicon photonics, or high-speed SerDes ecosystems
  • Experience bridging RTL ↔ physical design awareness (timing, floorplanning constraints, congestion-driven architecture decisions)
  • Exposure to AI/ML workloads from a hardware efficiency / data movement perspective (not algorithm development)
  • Remote-friendly (US) with preference for Bay Area proximity.

Also on the board Same function, level within a rung

Level

Lead

Location

Henrico, VA

Occupation

Electronics Engineers, Except Computer

Industry

Semiconductor and Related Device Manufacturing

Posted

yesterday

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