renesasAustin, TX
Head of Power Packaging & SiC/GaN Technology
Head of Power Packaging & SiC/GaN Technology
Head of Power Packaging & SiC/GaN Technology
renesasAustin, TX
yesterday
Semiconductor and Related Device ManufacturingOther Electronic Component ManufacturingElectronic Connector Manufacturing
Apply for this role →Renesas Electronics Corp. is seeking an senior-level professional to lead Package Technology Development/NPI, R&D, and Global OSAT management for new package development and product qualification. The role supports technology roadmaps and budgets while driving customer adoption programs. You will focus on design and development of package and interconnect methods for AI/datacenter infrastructure power packaging, including Smart Power Stages, Vertical Power Stages, Power Modules & Discrete FETs.
Also on the board Same function, level within a rung
Level
Manager
Location
Austin, TX
Occupation
Electronics Engineers, Except Computer
Industry
Semiconductor and Related Device Manufacturing
Posted
yesterday